In the past electronic devices have mainly been advanced regarding performance, power consumption and costs. A further interesting property of future electronics is mechanical flexibility, which can come together with advantageous features such as bendability, stretchability, light weight, ultra thinness, transparency, large area integration and easy recyclability. These properties can be achieved by modern TOLAE (thin film organic and large area electronics) technologies.

The FFlexCom programme wants to pave the way for circuits and systems for wireless communications, which are fully integrated in TOLAE technologies.